Infrared sensor structure and method

ABSTRACT

A radiation sensor ( 27 ) includes a radiation sensor chip ( 1 ) including first ( 7 ) and second ( 8 ) thermopile junctions connected to form a thermopile ( 7,8 ). The first thermopile junction is disposed in a floating portion of a dielectric membrane ( 3 ) thermally insulated from a silicon substrate ( 2 ) of the chip, and the second thermopile junction is disposed in the dielectric membrane directly adjacent to the substrate. Bump conductors ( 28 ) are bonded to corresponding bonding pads ( 28 A) coupled to the thermopile ( 7,8 ) to physically and electrically connect the chip to conductors on a printed circuit board ( 23 ). The silicon substrate transmits infrared radiation to the thermopile while blocking visible light.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of application Ser. No. 12/380,316,filed Feb. 26, 2009 (now U.S. Pat. No. 8,604,435), the entirety of whichis herein incorporated by reference.

BACKGROUND OF THE INVENTION

This invention is related to the assignee's co-pending applications:

-   -   Ser. No. 12/380,318, which is entitled “ON-CHIP CALIBRATION        SYSTEM AND METHOD FOR INFRARED SENSOR” and filed Feb. 26, 2009;    -   Ser. No. 12/456,910, entitled “METHOD AND STRUCTURES FOR ETCHING        CAVITY IN SILICON UNDER DIELECTRIC MEMBRANE” and filed on Jun.        24, 2009;    -   Ser. No. 12/454,257 (now U.S. Pat. No. 8,026,177), which is        entitled “SILICON DIOXIDE CANTILEVER SUPPORT AND METHOD FOR        SILICON ETCHED STRUCTURES” and filed on May 14, 2009;    -   Ser. No. 13/208,130, which is entitled “SILICON DIOXIDE        CANTILEVER SUPPORT AND METHOD FOR SILICON ETCHED STRUCTURES” and        filed on Aug. 11, 2011; and    -   Ser. No. 13/208,098, which is entitled “SILICON DIOXIDE        CANTILEVER SUPPORT AND METHOD FOR SILICON ETCHED STRUCTURES” and        filed on Aug. 11, 2011.

The present invention relates generally to varioussemiconductor-processing-compatible infrared (IR) sensor structures andfabrication methods, and more particularly to improved IR radiationsensing structures and processes which reduce size and cost of IRsensors and which provide smaller, more economical, more sensitive IRradiation intensity measurements.

The closest prior art is believed to include the article “InvestigationOf Thermopile Using CMOS Compatible Process and Front-Side Si BulkEtching” by Chen-Hsun-Du and Chengkuo Lee, Proceedings of SPIE Vol. 4176(2000), pp. 168-178, incorporated herein by reference. Infraredthermopile sensor physics and measurement of IR radiation usingthermopiles are described in detail in this reference. Prior Art FIG. 1herein shows the CMOS-processing-compatible IR sensor integrated circuitchip in FIG. 1 of the foregoing article. “Prior Art” FIG. 1 herein issimilar to that drawing.

Referring to Prior Art FIG. 1 herein, the IR sensor chip includes asilicon substrate 2 having a CMOS-processing-compatible dielectric(SiO₂) stack 3 thereon including a number of distinct sub-layers. AN-type polysilicon (polycrystalline silicon) trace 11 and an aluminumtrace M1 in dielectric stack 3 form a first “thermopile junction” wherethe polysilicon trace and the aluminum trace are joined. Additionaloxide layers and additional metal traces also may be included indielectric stack 3. An oxide passivation layer 12A is formed on top ofdielectric stack 3, and a nitride passivation layer 12B is formed onoxide passivation layer 12A. A number of silicon etchant openings 24extend through nitride passivation layer 12 and dielectric stack 3 tothe top surface of silicon substrate 2 and are used to etch a cavity 4in silicon substrate 2 underneath the portion of dielectric stack 3 inwhich the thermopile is formed, to thermally isolate it from siliconsubstrate 2.

A second thermopile junction (not shown) is also formed in dielectricstack 3 but is not thermally isolated from silicon substrate 2 andtherefore is at the same temperature as silicon substrate 2. Thetemperatures of the first and second thermopile junctions are designatedT1 and T2, respectively. The first and second thermopile junctions areconnected in series and form a single “thermopile”. The various siliconetchant openings 24 are formed in regions in which there are nopolysilicon or aluminum traces, as shown in the dark areas in FIG. 2 ofthe Du and Lee article.

Incoming IR radiation indicated by arrows 5 in Prior Art FIG. 1 impingeson the “front side” or “active surface” of the IR sensor chip. (The“back side” of the chip is the bottom surface of silicon substrate 2 asit appears in Prior Art FIG. 1.) The incoming IR radiation 5 causes thetemperature of the thermopile junction supported on the “floating”portion of dielectric membrane 3 located directly above cavity 4 to begreater than the temperature of the second thermopile junction (notshown) in dielectric membrane 3 which is not insulated by cavity 4.

The IR radiation sensor in Prior Art FIG. 1 measures the temperaturedifference T1−T2 and produces an output voltage proportional to thattemperature difference. The aluminum trace and N-type polycrystallinesilicon trace of which the first and second thermopile junctions areformed both are available in a typical standard CMOS wafer fabricationprocess.

A polycrystalline silicon heater is shown in FIG. 2 of the Du and Leearticle, and is described as providing a given bias leading tothermopile power generation used to characterize the thermal conductanceand capacitance of the thermopile membrane materials.

The prior art laboratory approach to calibrating thermopile responsivityrequires a previously calibrated infrared radiation source. The IRsensor is illuminated by a known IR source, and the resulting value ofVout is measured. Then a somewhat complicated calculation of theinfrared power being absorbed by the thermopile is performed in order todetermine the responsivity in volts per watt. The prior art calibrationprocedure is very sensitive to the equipment set-up and to the variancesand accuracy of the various components of the equipment set-up.

The Du and Lee article describes the IR sensor mounted inside a metalpackage having a window through which ambient IR radiation passes toreach the thermopile in the packaged IR sensor chip. The IR sensor chipdescribed in the Du and Lee article is not believed to have ever beencommercially available.

The prior art also includes the commercially available MLX90614 familyof IR radiation sensors marketed by Melexis Microelectronic IntegratedSystems. These devices are packaged in metal TO-39 packages havingwindows through which impinging IR radiation can pass in order to reachthe packaged IR sensors.

The above described prior art IR sensors require large, expensivepackages. The foregoing prior art IR radiation sensors need to blockvisible light while transmitting IR radiation to the thermopiles inorder to prevent false IR radiation intensity measurements due toambient visible lighting conditions. To accomplish this, the packagestypically have a silicon window or a window with baffles. Furthermore,the “floating” portion of dielectric membrane over cavity 4 in Prior ArtFIG. 1 is quite fragile. In many of the prior art IR sensors, thesilicon cavity is etched from the “back side” of the silicon wafer. Thiscreates a large opening span that is difficult to protect.

It would be highly desirable to provide smaller, more economical, andmore robust IR sensors than are known in the prior art for variousapplications such as non-contact measurement of temperature and remotemeasurement gas concentrations. It is believed that many markets wouldbe very receptive to substantially smaller, substantially moreeconomical IR radiation sensor devices than those of the prior art.

Thus, there is an unmet need for an IR radiation sensor which issubstantially smaller and less expensive than the IR radiation sensorsof the prior art.

There also is an unmet need for a more accurate IR radiation sensor thanhas been found in the prior art.

There also is an unmet need for an IR radiation sensor which providesmore sensitive, more accurate measurement of IR radiation than the IRradiation sensors of the prior art.

There also is an unmet need for a CMOS-processing-compatible IRradiation sensor chip which does not need to be packaged in a relativelylarge, expensive package having a window.

There also is an unmet need for a CMOS-processing-compatible IRradiation sensor chip which is substantially more robust than those ofthe prior art.

There also is an unmet need for an improved method of fabricating aninfrared radiation sensor.

There also is an unmet need for an improved method of fabricating aCMOS-processing-compatible IR sensor device which does not requirebonding the CMOS-processing-compatible IR sensor chip in a relativelylarge, expensive package having an infrared window therein.

SUMMARY OF THE INVENTION

It is an object of the invention to provide an IR radiation sensor whichis substantially smaller and less expensive than the IR radiationsensors of the prior art.

It is another object of the invention to provide a more accurate IRradiation sensor than has been found in the prior art.

It is another object of the invention to provide an IR radiation sensorwhich provides more sensitive, more accurate measurement of IR radiationthan the IR radiation sensors of the prior art.

It is another object of the invention to provide an IR radiation sensorchip which does not need to be packaged in a relatively large, expensivepackage having an infrared window.

It is another object of the invention to provide an IR radiation sensorchip which is substantially more robust than those of the prior art.

It is another object of the invention to provide an improved method offabricating an infrared radiation sensor.

It is another object of the invention to provide an improved method offabricating a CMOS-processing-compatible IR sensor device which does notrequire packaging the CMOS-processing-compatible IR sensor chip in arelatively large, expensive package having a window therein.

It is another object of the invention to provide an improved method offabricating an IR sensor device which is more robust than those of theprior art.

Briefly described, and in accordance with one embodiment, the presentinvention provides a radiation sensor (27) which includes a radiationsensor chip (1) including first (7) and second (8) thermopile junctionsconnected to form a thermopile (7,8). The first thermopile junction isdisposed in a floating portion of a dielectric membrane (3) thermallyinsulated from a silicon substrate (2) of the chip, and the secondthermopile junction is disposed in the dielectric membrane directlyadjacent to the substrate. Bump conductors (28) are bonded tocorresponding bonding pads (28A) coupled to the thermopile (7,8) tophysically and electrically connect the chip to conductors on a printedcircuit board (23). The silicon substrate transmits IR radiation to thethermopile while blocking visible light.

In one embodiment, the invention provides a radiation sensor device (27)which includes an integrated circuit radiation sensor chip (1) includingfirst (7) and second (8) thermopile junctions connected in series toform a thermopile (7,8) within a dielectric stack (3) of the radiationsensor chip (1). A first thermopile junction (7) is more thermallyinsulated from a substrate (2) of the radiation sensor chip (1) than thesecond thermopile junction (8). A plurality of bonding pads (28A) on theradiation sensor chip (1) are coupled to the thermopile (7,8). Aplurality of bump conductors (28) are bonded to the bonding pads (28A),respectively, to physically and electrically connect the radiationsensor chip (1) to conductors on a printed circuit board (23), and nochip coating material blocks radiation to be sensed by the radiationsensor device (27). In the described embodiments, the first thermopilejunction (7) is insulated from the substrate (2) by means of a cavity(4) between the substrate (2) and the dielectric stack (3). In adescribed embodiment, the dielectric stack (3) is a CMOS semiconductorprocess dielectric stack including a plurality of SiO₂ sublayers (3-1,2. . . 6) and various polysilicon traces, titanium nitride traces,tungsten contacts, and aluminum metallization traces between the varioussublayers patterned to provide the first (7) and second (8) thermopilejunctions connected in series to form the thermopile (7,8). Each of thefirst (7) and second (8) thermopile junctions is composed of a pluralityof thermopile junctions connected in series, respectively.

In a described embodiment, CMOS circuitry (45) is coupled between first(+) and second (−) terminals of the thermopile (7,8) to receive andoperate on a thermoelectric voltage (Vout) generated by the thermopile(7,8) in response to infrared (IR) radiation received by the radiationsensor chip (1), the CMOS circuitry also being coupled to the bondingpads (28A).

In one embodiment, a gain and filter circuit (45A) amplifies and filtersthe output voltage (Vout) produced between the first (+) and second (−)terminals. In another embodiment, an amplifier (44) has an inputselectively coupled to receive the voltage (Vout) and an output of alocal temperature circuit (56). An output of the amplifier (44) iscoupled to an input of a delta-sigma analog-to-digital converter (55).The delta-sigma analog-to-digital converter (55) has an output (58)coupled to an input of a digital interpolator (59) for linearizing anoutput signal produced by the delta-sigma analog-to-digital converter(55).

In the described embodiments, the substrate (2) is composed of siliconto pass infrared radiation to the thermopile (7,8) and block visibleradiation. A passivation layer (12) is disposed on the dielectric stack(3). Of plurality of generally circular etchant openings (24) arelocated between the various traces and extend through the passivationlayer (12) and the dielectric layer (3) to the cavity (4) forintroducing silicon etchant to etch the cavity (4) into the siliconsubstrate (2). A cap layer (34) is disposed on the passivation layer(12) to cover the etchant openings (24) to protect the cavity (4) fromcontamination and to reinforce a portion of the dielectric stack (3)spanning the cavity (4). In the described embodiment, the passivationlayer (12) is composed of silicon nitride and the cap layer (34) iscomposed of roll-on epoxy film material and is of substantially greaterthickness than the dielectric stack (3).

In one embodiment, the invention provides a method for making aradiation sensor device (27), including providing first (7) and second(8) thermopile junctions connected in series in a dielectric stack (3)of a radiation sensor chip (1) to form a thermopile (7,8), and thermallyinsulating the first thermopile junction (7) from a substrate (2) of theradiation sensor chip (1), forming a plurality of bonding pads (28A) onthe radiation sensor chip (1), the bonding pads (28A) being coupled tothe thermopile (7,8), and bonding a plurality of bump conductors (28) tothe bonding pads (28A), respectively, to physically and electricallyconnect the radiation sensor chip (1) to conductors on a printed circuitboard (23). In the described embodiment, the first thermopile junction(7) is insulated from the substrate (2) by etching a cavity (4) in thesubstrate (2) between the first thermopile junction (7) and thesubstrate (2). The method includes coupling the thermopile (7,8) betweenfirst (11A) and second (11B) terminals of CMOS circuitry (45) includedin the radiation sensor chip (1) for receiving and operating upon athermoelectric voltage (Vout) generated by the thermopile (7,8) inresponse to radiation received by the sensor chip (1).

Any described embodiment, the dielectric stack (3) is a CMOS processdielectric stack including a plurality of SiO₂ sublayers (3-1,2 . . . 6)and various polysilicon traces, titanium nitride traces, tungstencontacts, and aluminum metallization traces between the varioussublayers patterned to provide the first (8) and second (7) thermopilejunctions connected in series, and wherein the substrate (2) is composedof silicon, wherein the method includes forming a passivation layer (12)on the dielectric stack (3), forming a plurality of etchant openings(24) located between the various traces and extending through thepassivation layer (12) and the dielectric layer (3) to the cavity (4),introducing silicon etchant through the etchant openings (24) to etchthe cavity (4) into the substrate (2), and forming a cap layer (34) onthe passivation layer (12) to cover the etchant openings (24) to protectthe cavity (4) from contamination and to reinforce a portion of thedielectric stack (3) spanning the cavity (4) by rolling epoxy filmmaterial onto the passivation layer (12), the cap layer (34) beingsufficiently thick and strong to substantially reinforce the portion ofthe dielectric stack (3) spanning the cavity (4). A gain and filteramplifier circuit (45A) is provided to amplify and filter the outputvoltage (Vout) produced between the first (11A) and second (11B)terminals in the CMOS circuitry (45).

In one embodiment, the invention provides a radiation sensor device (27)including a radiation sensor chip (1) including first (7) and second (8)thermopile junctions connected in series in a dielectric stack (3) ofthe radiation sensor chip (1) to form a thermopile (7,8), means (4) forthermally insulating the first thermopile junction (7) from a substrate(2) of the radiation sensor chip (1), and bump conductor means (28)bonded to a plurality of bonding pads (28A) coupled to the thermopile(7,8), respectively, for physically and electrically connecting theradiation sensor chip (1) to conductors of the printed circuit board(23).

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a section view diagram of a prior art IR radiation detectorsupported in a membrane formed in a CMOS-processing-compatible process.

FIG. 2 is a generalized section view diagram illustrating use of aninternal heater element to facilitate field calibration of an IRradiation detector such as the one shown in Prior Art FIG. 1.

FIG. 3A is a section view of a CMOS-processing-compatible IR sensor chipaccording to the present invention.

FIG. 3B is a section view of a CMOS-processing-compatible IR sensor chipfurther including an internal sichrome heater and calibration circuitryfor calibrating the thermopile in the chip.

FIG. 3C is a calibration circuit of FIG. 3B;

FIG. 4 is a more generalized section view diagram of the IR sensor ofFIG. 3A, indicating various minimum dimensions of one embodimentthereof.

FIG. 5 is a schematic section view diagram of theCMOS-processing-compatible IR sensor of FIG. 3A implemented in a WCSP(Wafer Chip Scale Package).

FIG. 6 is a bottom view of the WCSP package as shown in FIG. 5.

FIG. 7A is a generalized plan view illustrating the layout approach ofthe thermopiles in details 7 and 8 in FIG. 3A.

FIG. 7B is an enlarged plan view of thermopiles in details 7 and 8 asshown in FIG. 6.

FIG. 8 is a schematic view of an analog gain/filter circuit which can beincluded in CMOS circuitry block 45 of FIG. 3A.

FIG. 9A is a diagram of digital signal processing circuitry that can beincluded in block 45 of FIG. 3A and internal responsivity calibrationstructure and circuitry that can be included in block 67 of FIG. 3B.

FIG. 9B is a schematic diagram of circuitry in block 56 of FIG. 9A.

FIGS. 10A-10G show a sequence of section view diagrams of the IR sensorstructures generated according to the process for fabricating the IRsensor chip of FIG. 3A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 2 shows a schematic representation of a IR sensor chip 1 of thepresent invention, with the sensor chip 1 inverted relative to theorientation shown in FIG. 1. In FIG. 2, IR detector chip 1 includessilicon substrate 2 in which cavity 4 is formed. A conventionalCMOS-processing-compatible SiO₂ dielectric stack 3 is formed on thelower surface of silicon substrate 2. The upward-oriented back surfaceof silicon substrate 2 receives IR radiation 5 and passes it through toSiO₂ stack 3 while filtering out any ambient visible light. SiO₂ stack 3may contain various aluminum traces, polysilicon traces, and variousother traces and metal contacts that are available in some conventionalCMOS wafer fabrication processes. A first thermopile junction 7 isformed by dissimilar materials within dielectric stack 3 adjacent tocavity 4, and is thermally insulated, by cavity 4, from siliconsubstrate 2. A second thermopile junction 8 is formed by dissimilarmaterials within dielectric stack 3 adjacent to the lower surface ofsilicon substrate 2. Thermopile junctions 7 and 8 are connected inseries, as indicated by dashed line 9, to form a thermopile 7,8. Theterminals of thermopile 7,8 are schematically represented by conductors11A and 11B.

The portion of SiO₂ stack 3 spanning the opening of cavity 4 forms athin “floating” membrane which supports thermopile junction 7, and alsosupports a resistive heater 6 if one is used. IR radiation 5 impingesuniformly on the upper surface of silicon substrate 2, differentiallyheating both of thermopile junctions 7 and 8. This results in thetemperature T1 of thermopile junction 7 and the temperature T2 ofthermopile junction 8 being different because of the insulative orthermal resistance properties of cavity 4. The thermoelectric outputvoltage difference Vout between thermopile terminals 11A and 11B in FIG.2 is generally indicated by the simplified expressionVout=(T1−T2)(S1−S2),where T1−T2 is the temperature difference between the two thermopilejunctions 7 and 8, and where S1 and S2 are the Seebeck coefficients ofthermopile 7,8. Different materials have different Seebeck coefficients.The Seebeck coefficient of a thermopile is a measured physical constantthat is a function of the difference between the polysilicon andaluminum materials of which the thermopile is composed. Each of thepolysilicon material and the aluminum material has its own Seebeckcoefficient, the polysilicon having the higher Seebeck coefficient. Thedifference in the Seebeck coefficients of the polysilicon and thealuminum, multiplied by the temperature difference T1−T2, is the outputvoltage Vout of the series-connected poly/aluminum thermopile junctions7 and 8 which form thermopile 7,8.

A resistive heater 6 may be formed within SiO₂ stack 3, for the purposeof facilitating convenient field calibration of the responsivity ofthermopile 7,8, wherein the responsivity is defined as the output signal(Vout) in volts per watt of power absorbed by thermopile 7,8 Note thatheater 6 is unlike the heater shown in FIG. 2 of the Du and Lee article,which is used for characterizing heat conductance and capacitance in thefloating thermopile membrane over the cavity of the IR sensor structure.

FIG. 3A shows a cross-section of an integrated circuit IR sensor chip 1which includes silicon substrate 2 and cavity 4 therein, generally asshown in FIG. 2 except that chip 1 is inverted. Silicon substrate 2includes a thin layer (not shown) of epitaxial silicon into which cavity4 is etched, and also includes the silicon wafer substrate on which theoriginal epitaxial silicon layer is grown. IR sensor chip 1 includesSiO₂ stack 3 formed on the upper surface of silicon substrate 2. SiO₂stack 3 includes multiple oxide layers 3-1,2 . . . 6 as required tofacilitate fabrication within SiO₂ stack 3 of N-doped polysilicon layer13, titanium nitride layer 15, tungsten contact layers 14-1, 14-2, 15-1,15-2, and 17, first aluminum metallization layer M1, second aluminummetallization layer M2, third aluminum metallization layer M3, andvarious elements of CMOS circuitry in block 45. (Note however, that insome cases it may be economic and/or practical to provide onlythermopile 7,8 on IR sensor chip 1 and provide all signal amplification,filtering, and/or digital or mixed signal processing on a separate chipor chips.)

The various layers shown in dielectric stack 3, including polysiliconlayer 13, titanium nitride layer 15, aluminum first metallization layerM1, aluminum second metallization layer M2, and aluminum thirdmetallization layer M3 each are formed on a corresponding oxidesub-layer of dielectric stack 3. Thermopile 7,8 thus is formed withinSiO₂ stack 3. Cavity 4 in silicon substrate 2 is located directlybeneath thermopile junction 7, and therefore thermally insulatesthermopile junction 7 from silicon substrate 2. However thermopilejunction 8 is located directly adjacent to silicon substrate 2 andtherefore is at essentially the same temperature as silicon substrate 2.A relatively long, narrow polysilicon trace 13 is disposed on a SiO₂sub-layer 3-1 of dielectric stack 3 and extends between tungsten contact14-2 (in thermopile junction 7) and tungsten contact 14-1 (in thermopilejunction 8). Titanium nitride trace 15 extends between tungsten contact15-1 (in thermopile junction 8) and tungsten contact 15-2 (in thermopilejunction 7). Thus, polysilicon trace 13 and titanium nitride trace 15both function as parts of thermopile 7,8. Thermopile 7,8 is referred toas a poly/titanium-nitride thermopile, since the Seebeck coefficients ofthe various aluminum traces cancel and the Seebeck coefficients of thevarious tungsten contacts 14-1, 14-2, 15-2, and 17 also cancel becausethe temperature difference across the various connections is essentiallyequal to zero.

The right end of polysilicon layer 13 is connected to the right end oftitanium nitride trace 15 by means of tungsten contact 14-2, aluminumtrace 16-3, and tungsten contact 15-2 so as to form “hot” thermopilejunction 7. Similarly, the left end of polysilicon layer 13 is connectedby tungsten contact 14-1 to aluminum trace 11B and the left end oftitanium nitride trace 15 is coupled by tungsten contact 15-1, aluminumtrace 16-2, and tungsten contact 17 to aluminum trace 11A, so as tothereby form “cold” thermopile junction 8. The series-connectedcombination of the two thermopile junctions 7 and 8 forms thermopile7,8.

Aluminum metallization interconnect layers M1, M2, and M3 are formed onthe SiO₂ sub-layers 3-3, 3-4, and 3-5, respectively, of dielectric stack3. A conventional silicon nitride passivation layer 12 is formed onanother oxide sub-layer 3-6 of dielectric layer 3. A number ofrelatively small-diameter etchant holes 24 extend from the top ofpassivation layer 12 through dielectric stack 3 into cavity 4, betweenthe various patterned metallization (M1, M2 and M3), titanium nitride,and polysilicon traces which form thermopile junctions 7 and 8. Assubsequently explained, silicon etchant is introduced through etchantholes 24 to etch cavity 4 into the upper surface of silicon substrate 2.Note that providing the etchant openings 24 is not conventional instandard CMOS processing or bipolar integrated circuit processing, noris the foregoing silicon etching used in this manner in standard CMOSprocessing or bipolar integrated circuit processing.

The small diameters of etchant holes 24 are selected in order to providea more robust floating thermopile membrane, and hence a more robust IRradiation sensor. The diameters of the etchant hole openings 24 can varyfrom 10 microns to 30 microns with a spacing ratio of 3:1 maximum to1:1. The spacings between the various etchant openings 24 can be in arange from approximately 10 to 60 microns. The smaller spacing ratio(i.e., the distance between the edges of the holes divided by thediameter of the holes) has the disadvantage that it results in lowertotal thermopile responsivity, due to the packing factor (the number ofthermopile junctions per square millimeter of surface area) of the manythermopile junctions (see FIGS. 6, 7A and 7B) of which thermopilejunctions 7 and 8 are composed, respectively. However, a smaller spacingratio results in a substantially faster silicon etching time. Therefore,there is a trade-off between the robustness of the membrane and the costof etching of cavity 4.

In accordance with the described embodiments of the invention, a roll-onepoxy film 34 is provided on nitride passivation layer 12 to permanentlyseal the upper ends of etch openings 24 and to reinforce the “floatingmembrane” portion of dielectric layer 3. Although there may be someapplications of the invention which do not require epoxy cover plate 34,the use of epoxy cover plate 34 is an important aspect of providing areliable WCSP package configuration of the IR sensors of the presentinvention. In an embodiment of the invention under development, epoxycover plate 34 is substantially thicker (roughly 16 microns) than theentire thickness (roughly 6 microns) of dielectric stack 3.

FIG. 4 illustrates minimum dimensions, in microns, of the variousfeatures of cavity 4 and the “floating” membrane portion of dielectriclayer 3 which supports thermopile junction 7 above cavity 4, for anembodiment of the invention presently under development. In thatembodiment the etchant openings are at least 10 microns (g) in diameterand are spaced at least approximately 10μ apart. The span of cavity 4 istypically 400μ, and its depth is at least 10μ.

The titanium nitride is used instead of aluminum because titaniumnitride has lower thermal conductivity than aluminum. The higher thermalconductivity of aluminum causes it to provide a thermal path that lowersthe responsivity of the IR sensor. Using the titanium nitride instead ofaluminum helps to minimize the thermal conductivity and also helps tomaximize the Seebeck response by increasing the T1−T2 temperaturedifference of the thermopile junction 7 in FIG. 3A. (In some standardCMOS processes, the titanium nitride is used for the top layer of thepolysilicon/titanium nitride capacitor and also is used for connectionto sichrome resistors.) Since thermopile junctions 7 and 8 are connectedin series, the Seebeck coefficient of one is subtracted from the Seebeckcoefficient of the other. Since there are two aluminum connections inthermopile 7,8, the Seebeck coefficients of the polysilicon and thetitanium nitride materials of which thermopile 7,8 is composed aresummed algebraically to obtain the net Seebeck coefficient between thetitanium nitride and the polysilicon in thermopile 7,8 and the Seebeckcoefficients of the aluminum connections cancel. The net Seebeckcoefficient is a fairly large, easy-to-measure voltage, typicallybetween 1 μV (microvolt) and 1 mV (millivolt). That voltage ismultiplied by the temperature difference T1−T2 between thermopilejunctions 7 and 8 to generate the value of Vout according to thepreviously indicated equation. Typically, many thermopile junctions(e.g. 200-300 or more) are connected in series in order to provide athermopile having greater responsivity (i.e., larger output voltage).

The differential voltage Vout generated between (−) conductor 11B and(+) conductor 11A can be applied to the input of the CMOS circuitry inblock 45. Block 45 can include the gain/filter amplifier 45A in FIG. 8or some or all of the “mixed signal” circuitry 45B shown FIG. 9A.

Referring to FIG. 3B, IR sensor chip 1B is the same as chip 1A in FIG.3A except that an internal resistive sichrome (SiCr) heater 6 has beenincluded in SiO₂ stack 3 directly above cavity 4 and thermopile junction7. Sichrome heater 6 is formed by elongated sichrome trace 6, which isdisposed on a SiO₂ sublayer between the M1 and M2 metallization layers.The right end of sichrome trace 6 is connected by tungsten contact 65 toan aluminum trace 63 of the M2 metallization layer to form a (−)terminal of CMOS thermopile responsivity calibration circuitry in block67, various parts of which are included in silicon substrate 2. The leftend of sichrome trace 6 is coupled by a pair of tungsten contacts 64 andan aluminum trace of the M2 metallization layer to the left end of analuminum trace 19 of the M3 metallization layer to form a (+) terminalof the thermopile responsivity calibration circuitry in block 67.(Alternatively, resistive heater 6 could be composed of polycrystallinesilicon or other resistive material instead of sichrome.)

Subsequently described FIG. 9A in part shows a simplified diagram ofresponsivity calibration circuitry including a switch 69 of FIG. 3C suchas may be found in FIG. 3B, controlled by a signal CALIBRATE thatconnects one terminal of sichrome heater 6 to a reference voltage V+,the other terminal of sichrome heater 6 being connected by conductor 66to one terminal of a current source 50, the other terminal of which isconnected to ground. The signal CALIBRATE turns on switch 69 at leastlong enough for thermal equilibrium to be established between heatingelement 6 and thermopile junction 7, typically at least a number ofmilliseconds. Current source 50 determines the amount of current flowingthrough sichrome heater 6. The upper terminal 68 of sichrome heater 6 isconnected to another terminal of switch 51, and the lower terminal 66 ofsichrome heater 6 is connected to another terminal of switch S2.Therefore, delta-sigma ADC 55 functions as a high-impedance voltmeterwhen the pole terminals of single-pole, triple throw switches S1 and S2are connected to conductors 68 and 66, respectively. Therefore, theknown current through current source 50 can be multiplied by the voltageacross sichrome heater 6 during the calibration process to compute thepower dissipated in sichrome heater 6 and hence also absorbed bythermopile junction 7.

Circuitry included in block 67 of FIG. 3B uses digital values producedby ADC 55 and subsequently described digital interpolator 59 to multiplythe voltage across sichrome heater 6 by the current in current source 50to obtain the power dissipation (in watts) and uses that information todetermine a responsivity calibration factor. That calibration factor isused as a scale factor in digital interpolator 59. The above mentionedmultiplication occurs within digital interpolator 59.

The purpose of the responsivity calibration process is to establish Voutas a function of the number of watts being dissipated in thermopile 7,8.The responsivity of thermopile 7,8 is the number of volts (Vout)generated by the thermopile 7,8 divided by the amount of power in wattsbeing dissipated therein. The value of Vout in volts is obtained fromthe measurement of Vout produced by thermopile 7,8. Since sichromeheater 6 and the calibration circuitry in block 67 are embedded ininfrared sensor chip 1, there is no variance from one responsivitycalibration operation to the next. In contrast, the previously describedprior art calibration procedure is much more sensitive to the equipmentset-up and variances in accuracy of the various components of theequipment set-up. The accuracy of the measurement of current andresistance is greater than 0.01%.

Note that increasing of the thermal conductivity of the “floating”sensor membrane and the cavity 4 and the conductivity of the thermopilereduces the sensitivity, in volts per watt, of thermopile 7,8. Also, theinfrared absorption efficiency of the IR sensor chip 1 also determinesthe sensitivity of thermopile 7,8. The Seebeck coefficient of thematerials in the thermopile also affect the sensor chip sensitivity. Theinternal heater 6 and calibration procedure of the present invention canbe used to determine the combination of thermal conductivity and Seebeckcoefficient for the thermopile. The thermal conductivity and Seebeckcoefficient are not independently determined by this measurement. Allterms are included in the measured values of Vout while the power isapplied. In other words, Vout includes the effects of the thermalconductivity and the Seebeck coefficient and the number of thermopilejunctions. The only remaining term which needs to be calibrated “in thefield” is the IR absorption, and if the absorber material properties aresufficiently small (±5%), then no field calibration will be required.However, if prior art “laboratory” calibration techniques are used, thena significant amount of calibration range will be necessary in order toobtain the required sensor performance. There can be a variation of+−20% in thermal conductivity, which will need to be taken into accountby the calibration. The amount of expected variation in IR absorption is+−5%.

FIG. 5 shows a partial section view including an IR sensor device 27which includes above described IR sensor chip 1 as part of a modifiedWCSP (Wafer Chip Scale Package), wherein various solder bumps 28 arebonded to corresponding specialized solder bump bonding pads 28A on IRsensor chip 1. The modified WCSP technique indicated in FIG. 5 does notinclude any encapsulation material on the top surface of IR sensor chip1, in order to avoid blocking the incident IR radiation 5. (Note thatthe prior art provides epoxy encapsulation or the like on the topsurface of a WCSP-packaged chip. However, this would block IR radiation5 as shown in FIG. 5. Therefore, no coating or encapsulation that wouldblock IR radiation 5 should be provided on top of IR sensor chip 1 asshown in FIG. 5.) The various solder bumps 28 are also bonded tocorresponding traces 23A on a printed circuit board 23. (It is believedthat one reason that WCSP packaging for the previously mentioned Du andLee infrared sensor is that the floating membrane supporting one of thethermopile junctions over the cavity as shown in FIG. 1 of Du and Lee(Prior Art FIG. 1 herein) is far too fragile. The fragility is partlycaused by the irregular sizes and spacings of the etchant openings andpartly by the thinness of the dielectric layer 3.)

FIG. 6 shows a bottom view of the WCSP-packaged IR sensor chip 1 andsolder bumps 28. Eight solder bumps 28 are provided as shown along the 4edges of IR sensor chip 1 (although a conventional WCSP package alsoincludes a centered ninth solder bump). The thermopile membrane in whichthermopile junction 7 is supported is located generally in the middleportion of IR sensor chip 1, as indicated by reference 7 in FIG. 6, andis too fragile to support a solder bump, so the typical middle solderbump of a standard WCSP package is omitted from IR sensor device 27.Furthermore, a middle solder bump would tend to act as a thermal shortcircuit and reduce the responsivity of thermopile 7,8 to the ambient IRradiation to nearly zero.

The bumps or “bump conductors” 28 may be composed of lead-tin orgold-tin, and are bonded to the active surface of IR sensor chip 1 toform IR sensor device 27 as a WCSP packaged chip. (Somewhat differentbonding pad configurations are used on integrated circuit chips if bumpconductors are to be formed on the bonding pads, in order to accommodatethe bump conductors.) The solder bump bonding pads typically are 300μ indiameter, as apposed to 75μ in diameter for typical wire bonding pads.(Copper plating typically is provided on the solder bump bonding pads toenable solder to wet to the surface.)

The presence of cover plate 34 in FIGS. 3A and 3B, the thickness ofwhich may be comparable to or greater than the thickness of dielectriclayer 3, substantially strengthens the floating membrane portion ofdielectric stack 3. Without the previously mentioned small, circularetchant openings 24 and the strong, relatively thick cover plate 34, theWCSP packaging of the IR sensor chips shown in FIGS. 3A and 3B isimpractical.

FIG. 7A is a partial plan view wherein reference numeral 7A shows thelayout of a few of the polysilicon traces 13 and titanium nitride traces15 of which multiple thermopile junctions 7 are composed. The titaniumnitride traces 13 are located directly over polysilicon traces 15, asshown in FIG. 3A. Trace 16-3 of the M1 metallization layer connectstungsten vias 14-2 and 15-2 in FIG. 7A, as also shown in FIG. 3A.

FIG. 7B shows an expanded view including the portion 7A of thermopilejunction 7 appearing in the area designated by reference numeral 7 shownin FIG. 6.

FIG. 8 is a schematic diagram of a thermopile gain/filter circuit 45Awhich can be included in block 45 in FIGS. 3A and 3B. In FIG. 8,gain/filter circuit 45A includes an input amplifier stage 47, a filterstage 48, and an output stage 49. This circuitry, which is conventionalin IR sensor devices, provides an analog technique for converting a lowlevel, high impedance input voltage to a high level, low impedanceoutput voltage. The input impedance typically is between 1 megohm and 40megohms. The signal Vout produced by thermopile 7,8 can be from about amicrovolt to a millivolt, and typically needs to be amplified by atleast 1000. The filtering provided by gain/filter circuit 45A isdesirable because a typical temperature measurement of an IR radiationsource occurs at a very low frequency close to DC (e.g., less than about10 Hz). Gain/filter amplifier 45A filters out high-frequency noise, tothereby provide an improved signal-to-noise ratio of IR sensor chip 1.(Note however, that this does not decrease the inherent noise in the IRsensor itself. The inherent noise of the IR sensor is a function of thesensor resistance.

Alternatively, CMOS circuitry in block 45 in FIG. 3A may include part orall of the circuitry shown in FIG. 9A. Referring to FIG. 9A, a simple,high input impedance amplifier 44 has its (+) and (−) inputs connectedto receive the thermoelectric voltage Vout produced by thermopile 7,8.Output 51 of amplifier 44 is connected to one terminal of switch S1, thepole terminal of which is connected to one input of analog-to-digitalconverter (ADC) 55, which may be a conventional delta sigma ADC.Similarly, output 52 of amplifier 44 is connected to one terminal ofswitch S2, the pole terminal of which is connected to another input ofADC 55. Another terminal of switch S1 is connected to one input of alocal temperature measurement circuit 56, and another terminal of switchS2 is connected to the other input of local temperature measurementcircuit 56. Switches S1 and S2 sequentially sample amplifier output 2and the local temperature (i.e., the temperature of substrate 2) intoADC 55 for conversion, and those results are input via bus 58 to digitalinterpolator 59

Digital interpolator 59 produces a linearized digital output signal thatrepresents the temperature of the remote IR source sensed by thermopile7,8. Local temperature measurement circuit 56 is based on a conventionalbandgap circuit, one implementation of which is shown in FIG. 9B.

Digital interpolator circuit 59 may be implemented in various well-knownways, for example by means of a digital signal processor (DSP) asindicated on page 10 of the July, 2008 datasheet for the MLX90614 familyof IR sensors marketed by Melexis Microelectronic Integrated Systems.Alternatively, digital interpolator circuit 59 may be implemented bymeans of a lookup table stored in a read-only memory (ROM). The valuesstored in the read-only memory can be determined generally in accordancewith the following analysis and equations.

The local temperature measurement exploits the well known V_(BE)characteristics of bipolar transistors. The ADC 55 in FIG. 9A compares avoltage proportional to the absolute temperature V_(PTAT) to a referencevoltage V_(REF) which is constant with temperature. The localtemperature circuit 56 in FIG. 9A and shown in detail in subsequentlydescribed FIG. 9B performs this function to generate a voltagerepresentative of the foregoing absolute temperature T. The ratio ofthese two voltages provides the absolute temperature T. The PTAT(proportional to absolute temperature) voltage is the difference betweentwo base-emitter voltages of bipolar transistor operating withdissimilar current densities:V _(PTAT) =kT/q ln(mn)  Eq. 1.0

Here, m is the transistor emitter area ratio and n is the current ratioin the PTAT circuitry. The base-emitter voltage of a bipolar transistoris:

$\begin{matrix}{{V_{BE}\left( {T,I_{C}} \right)} = {E_{g} - {\frac{T}{T_{0}}\left( {E_{g} - V_{{BE},0}} \right)} + {\frac{k\; T_{0}}{q} \times \frac{T}{T_{0}}{\ln\left( \frac{I_{C}(T)}{I_{C}\left( T_{0} \right)} \right)}} - {\eta\;\frac{kT}{q}{\ln\left( \frac{T}{T_{0}} \right)}}}} & {{Eq}.\mspace{14mu} 1.1}\end{matrix}$The bandgap E_(g) of silicon, the curvature η and reference temperatureT₀ are constants, and the only variable parameter that needs to becompensated for is the base-emitter voltage V_(BE,0) at the referencetemperature T₀. It can be shown that a linear combination of V_(BE) andV_(PTAT) is approximately constant with a very small residual curvature:V _(REF) =αV _(PTAT) +V _(BE)  Eq. 1.2The gain coefficient α is trimmed in-circuit to compensate for thevariation of the initial base-emitter voltage. The ADC 55 in FIG. 9Atherefore measures the ratio

$\begin{matrix}{\frac{V_{PTAT}}{V_{REF}} = {\frac{V_{PTAT}}{{\alpha\; V_{PTAT}} + V_{BE}} = {\frac{\frac{k\; T}{q}{\ln({mn})}}{V_{REF}} \propto T}}} & {{{Eq}.\mspace{14mu} 1.}{.3}}\end{matrix}$The gains in the ADC implementation are selected in such a way that thedigital number representing the above ratio (the average value of thebit stream in a sigma delta ADC) can easily be converted in degreesCelsius.

The radiative heat transfer between the SiO₂ thermopile membrane and themeasured object is governed by Stefan-Boltzmann's law. In abovedescribed embodiments of the invention, the silicon substrate 2 used forthe WCSP package and also used as the visible light filter separates theinfrared-sensitive membrane and the IR-emitting object of interest. Thiscreates multiple reflections. The IR membrane is separated by from theIR-emitting object of interest by silicon substrate 2, which is a solidshield. The total power absorbed or emitted by the thermopile 7,8 perunit area is given by the following expression:

$\begin{matrix}{S_{12} = {\left( \frac{1}{\frac{1}{ɛ_{1}} + \frac{1}{ɛ_{2}} + \frac{1}{\tau} - 2} \right){\sigma\left( {T_{1}^{4} - T_{2}^{4}} \right)}}} & {{Eq}.\mspace{14mu} 1.4}\end{matrix}$where T2 is the surface temperature of the thermally isolated portion ofthe SiO₂ membrane 3, T1 is the temperature of the remote IR-emittingobject of interest, ∈2 and ∈1 are the emissivities of the sensingthermopile membrane and the IR-emitting object, respectively, τ is theinfrared transmission of the silicon substrate 2, and σ isStefan-Boltzmann's constant. The voltage output V_(tp) of the thermopile7,8 is proportional to its area A_(sensor) and responsivity

:

$\begin{matrix}{V_{tp} = {A_{sensor}\;\left( T_{2} \right)\left( \frac{1}{\frac{1}{ɛ_{1}} + \frac{1}{ɛ_{2}} + \frac{1}{\tau} - 2} \right){\sigma\left( {T_{1}^{4} - T_{1}^{4}} \right)}}} & {{Eq}.\mspace{14mu} 1.5}\end{matrix}$The built-in ADC 55 is used to measure V_(tp) and the local temperatureT2 and to calculate the temperature T1 of the remote IR-emitting objectusing the previously calibrated responsivity

and the constants ∈1, ∈2, τ, and σ, according to the followingexpression:

$\begin{matrix}{T_{1} = \sqrt[4]{\frac{V_{tp}}{A_{sensor}\;\left( T_{2} \right)\left( \frac{1}{\frac{1}{ɛ_{1}} + \frac{1}{ɛ_{2}} + \frac{1}{\tau} - 2} \right)\sigma} + T_{2}^{4}}} & {{Eq}.\mspace{14mu} 1.6}\end{matrix}$Since equation (1.6) is not easy to calculate directly in a small sizeIR sensor implementation without digital floating point mathcapabilities, a series of look-up tables and interpolations can bereadily used to reduce the IR sensor area and power consumption. Thelook-up table values can be readily pre-calculated and stored inread-only memory (ROM).

The “linearized” digital output produced on bus 60 by digitalinterpolator 59 can be utilized internally or externally as desired forvarious applications. If a corresponding analog output signal isdesired, it can be obtained by applying the digital output signal on bus60 to the input of a digital-to-analog converter (DAC) 61, whichgenerates the desired analog output signal on conductor 62. For example,the analog output signal on conductor 62 could be used in an analogcontrol loop in which the temperature is required as an input. Thedigital output signal on bus 60 could be used in an application in whichthe remote temperature value must be provided as an input to a computer.

Note that amplifier 44 does not include a filter because a filteringfunction (related to the sample frequency and the duration of each inputsampling process) is inherently built into delta-sigma ADC 5. Theprecision of the IR sensing operation is determined by the delta-sigmaconversion process.

The above mentioned linearization of the delta-sigma ADC outputgenerated on bus 58 by digital interpolator circuit 59 in FIG. 9A isnecessary because, as indicated in the foregoing analysis, the infraredenergy absorbed by thermopile 7,8 is proportional to the fourth power ofthe temperature of the remote body the temperature of which is beingmeasured, and therefore is very nonlinear with respect to temperature.The linearization process also is required in order to obtain thedigital representation on bus 60 of the temperature of the remote IRsource in degrees, rather than as a voltage. Alternatively, thelinearization could be accomplished using analog circuitry, but thatwould be less accurate, and would require substantially more circuitry(because high gain, offset compensation, and offset drift compensationwould be required). As a practical matter, these problems using analogcircuitry for the linearization would reduce the accuracy of the IRsensing.

An accurate value of the local temperature, i.e., the temperature ofthermopile 7, 8 is required to calculate the remote temperature of thesource of the IR radiation 5. The difference between remote temperatureand the local temperature determines the amount of power absorbed bythermopile 7,8.

In the described embodiments of the invention, the conventionallinearizing/interpolation procedure utilized can include selectingvalues from ROM look-up tables in digital interpolator circuit 59. Eachlook-up table contains values which are functions of the thermoelectricvoltage Vout generated by thermopile 7,8. A separate table is providedfor each of a number of values of the local temperature, respectively.The appropriate look-up table is selected according to the present valueof the local temperature, and then a value from the selected look-uptable is selected corresponding to the present value of the thermopileoutput voltage Vout.

FIG. 9B shows a schematic drawing of a well known implementation oflocal temperature circuit 56 in FIG. 9A. In FIG. 9B, local temperaturecircuit 56 includes an operational amplifier 82 having its (−) inputconnected to the emitter of a PNP transistor Q1, the base and collectorof which are connected to ground. The (+) input of amplifier 82 isconnected to a junction between resistors R1 and R2, the other terminalof resistor R2 being connected to the emitter of PNP transistor Q2, thebase and collector of which are connected to ground. The other terminalof resistor R1 is connected to the drain of P-channel transistor MP6,the source of which is connected to the drain of P-channel transistorMP2. The gate of transistor MP2 is connected to the output of amplifier82, the gate of P-channel transistor MP1, and the gate of P-channeltransistor MP4. The sources of transistors MP1, MP2, MP3, and MP4 areconnected to V_(DD). The gate of transistor MP6 is connected to thegates of P-channel transistors MP5, MP3, and MP7. The source and drainof transistor MP5 are connected to the source of transistor MP1 and theemitter of transistor Q1, respectively. The drain of transistor MP3 isconnected to its gate and a current source I1. The source of transistorMP7 is connected to the drain of transistor MP4. The drain of transistorMP7 is connected by conductor 53 to one terminal of resistor R3 and tothe drain of N-channel transistor MN1, the source of which is connectedto ground. The gate of transistor MN1 is connected to the gate and drainof a diode-connected N-channel transistor MN2, the source of which isconnected to ground. The other terminal of resistor R3 is connected toground. A current I2 flows through transistor MN2

In operation, transistors Q1, Q2, MP1, MP2, MP5 and MP6 and resistors R1and R2 of FIG. 9B operate to generate aproportional-to-absolute-temperature bandgap voltage V_(PTAT) which isapplied to the (+) input of amplifier 82. This bandgap voltage is usedto generate a local temperature voltage V_(LOCALTEMP) (i.e., T2 in theforegoing analysis) on conductor 53 representing the temperature ofsilicon substrate 2 (FIG. 3A).

FIGS. 10A-10G show a sequence of section view diagrams of the IR sensorstructures generated according to the process for fabricating the IRsensor chip 1 of FIG. 3A. FIG. 10A shows providing an SiO₂ layer 3-1 onthe upper surface of silicon substrate 2, and then depositing a layer ofpolysilicon on the upper surface of sublayer 3-1 (see FIG. 3A). Thelayer of polysilicon then is patterned so as to provide the traces 13required to fabricate thermopile 7,8, for example in the patternillustrated in FIG. 7B. Then, as indicated in FIG. 10B, another SiO₂sub-layer (sub-layer 3-2 in FIG. 3A) is deposited on the polysilicontraces 13, and then titanium nitride layer 15 is deposited on thatsublayer and then patterned to provide the traces 15 as required to makethermopile 7,8, for example in the pattern illustrated in FIG. 7B. Thensuitable via openings are provided through the SiO₂ sub-layers 3-2 and3-3, and tungsten contacts are formed in the via openings. Next, a firstmetallization layer M1 is deposited on the SiO₂ sub-layer 3-2 andpatterned as needed to provide connection to the tungsten contacts andany CMOS circuitry (not shown) that also is also being formed oninfrared sensor chip 1.

Then, as indicated in FIG. 10C, another SiO₂ sub-layer 3-4 (FIG. 3A) isdeposited on the first metallization M1. Suitable via openings then areformed therein, and tungsten vias are formed in those the openings. Thena second aluminum metallization layer M2 is deposited on SiO₂ sub-layer3-4 and patterned as necessary to complete the formation of thermopile7,8 and also to make connections that are required for any CMOScircuitry also being formed. Next, as indicated in FIG. 10D, anotherSiO₂ sub-layer 3-5 is deposited on the aluminum metallization M2. Athird aluminum metallization layer M3, also designated by referencenumeral 19, is formed on sub-layer 3-5 and patterned as needed. Then afinal dielectric sub-layer 3-6 is deposited on the M3 metallization tocomplete the structure of SiO₂ dielectric stack 3. Then, a siliconnitride passivation layer 12 is formed on dielectric sub-layer 3-6 (FIG.3A).

Next, as indicated in FIG. 10E, silicon etchant openings 24 are formed,extending from the upper surface of silicon substrate 2 to the topsurface of passivation layer 12. Then, as indicated in FIG. 10F, aconventional isotropic silicon etchant is introduced into etchantopenings 24 in order to etch cavity 4 in the upper surface of siliconsubstrate 2 so that cavity 4 has a shape determined by the locations ofthe various etchant openings 24. The portion of thin dielectric stack 3containing etchant openings 24 and thermopile junction 7 thus becomes amore robust “floating” thermopile membrane which is thermally isolatedby cavity 4 from silicon substrate 2. Finally, as indicated in FIG. 10G,a relatively thick roll-on epoxy film or other suitable permanent caplayer 34 is provided on the upper surface of silicon nitride passivationlayer 12 in order to permanently seal cavity 4 and etchant openings 24and substantially strengthen the “floating” portion of dielectricmembrane 3. This is desirable, because during subsequent wafer sawingoperations, a very vigorous water stream impinges on the surface of IRsensor chip 1, and would tend to crush the “floating” thermopilemembrane over cavity 4. Cap layer 34 also prevents silicon residuegenerated by the wafer sawing operations from entering cavity 4.

Thus, the above described embodiments of the invention use the siliconsubstrate 2 of IR sensor chip 1 in the WCSP package configuration 27, asshown in FIG. 5, as both a protection window and a visible light filter.The sizes, shape, and number of etchant openings 24 are selected tooptimize the strength of the “floating” thermopile membrane above cavity4, and thereby result in a more robust IR radiation sensor device.Finally, the epoxy cover plate 34 preferably is placed over the sensorto seal cavity 4 and strengthen the “floating” membrane portion ofdielectric layer 3 containing thermopile junction 7. This is in contrastto the prior art, which uses expensive hermetic packages with specialsilicon windows or windows with baffles to prevent stray visible lightfrom entering the sensor package.

While the invention has been described with reference to severalparticular embodiments thereof, those skilled in the art will be able tomake various modifications to the described embodiments of the inventionwithout departing from its true spirit and scope. It is intended thatall elements or steps which are insubstantially different from thoserecited in the claims but perform substantially the same functions,respectively, in substantially the same way to achieve the same resultas what is claimed are within the scope of the invention. For example,the basic theory of operation of the above described embodiments of theinvention is not necessarily limited to IR radiation wavelengths,although absorber material of (or associated with) the thermopiles mighthave to be changed to a different material that is more capable ofabsorbing ambient radiation of wavelengths other than infraredwavelengths. For shorter wavelengths, e.g., visible UV wavelengths, theimpinging radiation to be measured would need to impinge on the bottomof the integrated circuit chip structure as shown in FIG. 2 because thesilicon does not allow the transmission of visible light. (In thedescribed embodiments of the invention, the polysilicon traces 13function well as IR energy absorbers.) Cavity 4 can contain a vacuum, orgas, or other material having low thermal conductivity.

As another example, although FIG. 5 indicates the silicon substrate 2 ontop and the SiO₂ dielectric stack 3 on the bottom, in anotherimplementation of the invention, the IR sensor chip can be in a WCSPpackage configuration with the silicon substrate 2 facing downward toreceive the IR radiation to be measured. In this case, conductive viascan be provided which extend from active circuitry on the front side ofthe chip through the substrate 2 to make electrical connection to solderbumps bonded to the back surface of silicon substrate 2. The bumpconductors 28 could be copper studs instead of solder bumps. It shouldbe appreciated that is especially important to the objective ofachieving low cost and good performance of an IR sensor device of thepresent invention to provide a direct connection of the IR sensor chip 1to a PC board without providing any packaging material surrounding thechip. Also, it may be economic or practical to provide only thethermopiles on the IR sensor chip and provide all amplification andother signal processing on a different chip or chips.

What is claimed is:
 1. A radiation sensor device comprising: anintegrated circuit radiation sensor chip including first and secondthermopile junctions connected in series to form a thermopile within adielectric stack of the radiation sensor chip, the first thermopilejunction being more thermally insulated from a substrate of theradiation sensor chip than the second thermopile junction; a pluralityof bonding pads on the radiation sensor chip coupled to the thermopile;and a plurality of bump conductors bonded to the bonding pads,respectively, for physically and electrically connecting the radiationsensor chip to conductors on a printed circuit board, wherein no chipcoating material blocks radiation to be sensed by the radiation sensordevice.
 2. The radiation sensor device of claim 1 wherein the firstthermopile junction is insulated from the substrate by means of a cavitybetween the substrate and the dielectric stack.
 3. The radiation sensordevice of claim 2 wherein the dielectric stack is a semiconductorprocess dielectric stack including a plurality of SiO₂ sublayers andpolysilicon traces, titanium nitride traces, tungsten contacts, andaluminum metallization traces between the sublayers patterned to providethe first and second thermopile junctions connected in series to formthe thermopile.
 4. The radiation sensor device of claim 3 wherein thesemiconductor process dielectric stack is a CMOS process dielectricstack.
 5. The radiation sensor device of claim 3 wherein each of thefirst and second thermopile junctions is composed of a plurality ofthermopile junctions connected in series, respectively.
 6. The radiationsensor device of claim 5 further comprising CMOS circuitry coupledbetween first and second terminals of the thermopile to receive andoperate upon a thermoelectric voltage generated by the thermopile inresponse to infrared (IR) radiation received by the radiation sensorchip, the CMOS circuitry also being coupled to the bonding pads.
 7. Theradiation sensor device of claim 6 further comprising a gain and filtercircuit which amplifies and filters the voltage produced between thefirst and second terminals.
 8. The radiation sensor device of claim 6further comprising an amplifier having an input selectively coupled toreceive the voltage and an output of a local temperature circuit, theamplifier having an output coupled to an input of a delta-sigmaanalog-to-digital converter, the delta-sigma analog-to-digital converterhaving an output coupled to an input of a digital interpolator forlinearizing an output signal produced by the delta-sigmaanalog-to-digital converter.
 9. The radiation sensor device of claim 3wherein the substrate is composed of silicon to pass infrared radiationto the thermopile and block visible radiation, and further including apassivation layer disposed on the dielectric stack, a plurality ofcircular etchant openings located between one or more of the polysilicontraces, the titanium nitride traces, or the aluminum metallizationtraces and extending through the passivation layer and the dielectriclayer to the cavity for introducing silicon etchant to produce thecavity by etching the silicon substrate.
 10. The radiation sensor deviceof claim 9 further comprising a cap layer on the passivation layer tocover the etchant openings to protect the cavity from contamination andto reinforce a portion of the dielectric stack spanning the cavity. 11.The radiation sensor device of claim 10 wherein the passivation layer iscomposed of silicon nitride and the cap layer is composed of roll-onepoxy film material and is of substantially greater thickness than thedielectric stack.
 12. The radiation sensor device of claim 9 whereindiameters of the etchant openings are in a range from approximately 10to 20 microns and wherein spacings between the etchant openings are in arange from approximately 10 to 60 microns.
 13. The radiation sensordevice of claim 1 wherein the bump conductors are composed of lead-tin.14. A method for making a radiation sensor device, comprising: providingfirst and second thermopile junctions connected in series in adielectric stack of a radiation sensor chip to form a thermopile, andthermally insulating the first thermopile junction from a substrate ofthe radiation sensor chip; forming a plurality of bonding pads on theradiation sensor chip, the bonding pads being coupled to the thermopile;and bonding a plurality of bump conductors to the bonding pads,respectively, to physically and electrically connect the radiationsensor chip to conductors on a printed circuit board.
 15. The method ofclaim 14 further comprising insulating the first thermopile junctionfrom the substrate by etching a cavity in the substrate between thefirst thermopile junction and the substrate.
 16. The method of claim 15further comprising coupling the thermopile between first and secondterminals of CMOS circuitry included in the radiation sensor chip forreceiving and operating upon a thermoelectric voltage generated by thethermopile in response to radiation received by the sensor chip.
 17. Themethod of claim 16 wherein the dielectric stack is a CMOS processdielectric stack including a plurality of SiO₂ sublayers and polysilicontraces, titanium nitride traces, tungsten contacts, and aluminummetallization traces between the sublayers patterned to provide thefirst and second thermopile junctions connected in series, and whereinthe substrate is composed of silicon, the method further comprisingforming a passivation layer on the dielectric stack, forming a pluralityof etchant openings located between one or more of the polysilicontraces, the titanium nitride traces, or the aluminum metallizationtraces and extending through the passivation layer and the dielectriclayer to the cavity, introducing silicon etchant through the etchantopenings to etch the cavity into the substrate, and forming a cap layeron the passivation layer to cover the etchant openings to protect thecavity from contamination and to reinforce a portion of the dielectricstack spanning the cavity by rolling epoxy film material onto thepassivation layer, the cap layer being sufficiently thick and strong tosubstantially reinforce the portion of the dielectric stack spanning thecavity.
 18. The method of claim 17 further comprising providing a gainand filter amplifier circuit which amplifies and filters the outputvoltage produced between the first and second terminals in the CMOScircuitry.
 19. A radiation sensor device, comprising: a radiation sensorchip including first and second thermopile junctions connected in seriesin a dielectric stack of the radiation sensor chip to form a thermopile;means for thermally insulating the first thermopile junction from asubstrate of the radiation sensor chip; and bump conductor means bondedto a plurality of bonding pads coupled to the thermopile, respectively,for physically and electrically connecting the radiation sensor chip toconductors of a printed circuit board.